Low Dielectric PEEK

When considering a plastic to use for electronics packaging, a low dielectric constant is key. Delnova Materials Low Dielectric PEEK is modified to have a dielectric constant of 2.72, while still retaining the characteristic chemical and thermal stability of PEEK plastics. This material is a perfect choice for any electronics packaging that requires the reliable performance of PEEK.

Key Advantages:

• The dielectric constant of Low-Dielectric PEEK is 2.72.
• The dielectric loss constant of Low-Dielectric PEEK is less than 0.0025.
• Low-Dielectric PEEK has a continuous use temperature up to 260 °C.
• Low-Dielectric PEEK has excellent processing performance.
• Low-Dielectric PEEK can be injection molded, extruded, and processed via other molding methods.

Material Properties: